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Adhesives

 
  • UV and thermal cure, electrically conductive epoxies.
  • Two component, UV and/or thermally cured epoxy systems.
  • Single component, UV and/or thermally cured epoxy systems.
  • Single component, UV cure epoxy systems for potting, encapsulating and chip coating.
  • Single component, UV cure adhesives for assembly, tacking, fixturing, staking, globbing and gap filling.
  • Single component, UV cure adhesives for assembly, tacking, fixturing, staking, globbing and gap filling.
  • Single component, UV cure conformal coatings for P.C. boards, ferrites and components.
  • Single component, UV and/or thermal cured epoxy systems for chip coating and globbing.
  • Ultra violet light and thermally curable epoxy systems designed for opto-electronic assembly
  • Single component, highly filled system featuring extremely low CTE's and shrinkage upon cure.
  • Single component, optically clear materials for use in and around the light path
  • Two component, low temperature and room temperature cure materials.
  • Extremely fast, single component systems for fixturing, bonding and encapsulating.
  • Two component thermal cure epoxy systems.
  • Single component die attach materials for high speed dispensing.

 

 

 
 
 
 
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